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BackWith SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14), generated with kicad-footprint-generator Molex PicoBlade Connector System, 43045-1400 (alternative finishes: 43045-022x), 1 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator connector wire 0.15sqmm double-strain-relief Soldered wire connection with feed through.
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