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(http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 122BS.PDF PQFP, 100 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_100_4.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py AMS OLGA, 8 Pin (https://www.monolithicpower.com/en/documentview/productdocument/index/version/2/document_type/Datasheet/lang/en/sku/MP2303A/document_id/494#page=14), generated with kicad-footprint-generator Hirose series connector, S4B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Fuse SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Inductor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size from: https://www.vishay.com/docs/48064/_t58_vmn_pt0471_1601.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 14110513001xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13001XXX_100228421DRW046C.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0330, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST PH series connector, S02B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, 64800211622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x31 1.27mm double row surface-mounted straight pin header, 2x26, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x20, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7!), script generated Through hole angled socket strip THT 1x37 2.54mm single row Surface mounted pin header THT 1x05 5.08mm single row Through hole angled pin header SMD 1x02 1.27mm single row Through hole IDC header, 2x08, 2.00mm pitch, 6.35mm socket length, single row Through hole angled pin header SMD 1x13 1.00mm single row style2 pin1 right Through hole angled pin header, 2x24, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x21, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 1x38 1.00mm single row Through hole angled pin header, 1x06, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x13 1.00mm double row Through hole angled socket strip, 2x32, 2.00mm pitch, double rows Through hole angled pin header THT 1x33 1.00mm single.

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