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(900 mils), Socket 28-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 28-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 32-lead dip package, row spacing 6.73 mm (264 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 9x-dip-switch SPST , Slide, row spacing 8.61.

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