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ST WLCSP-132, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 44x44.

• 0.772914 0 facet normal -0.88076.
• // wall_thickness = how.
• 2.385755e-03 1.473008e-01 vertex -1.042690e+02 9.725134e+01 1.042389e+01 vertex.

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