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Vias 10-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 20 leads; body width 4.4 mm; (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Horizontal RM 0.97mm Multiwatt-9 staggered type-1 TO-220-11, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220F-11, Vertical, RM 2.54mm, see https://www.njr.com/semicon/PDF/package/TO-220F-4_E.pdf TO-220F-4 Horizontal RM 3.81mm Potentiometer, vertical, shaft hole, ACP CA9-V10, http://www.acptechnologies.com/wp-content/uploads/2017/05/02-ACP-CA9-CE9.pdf Potentiometer vertical Bourns 3314R-GM5 Potentiometer, horizontal, Bourns 3386C, https://www.bourns.com/pdfs/3386.pdf Potentiometer.

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