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BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x14 2.00mm double row Connector IDC Locked, 10 contacts, compatible header: PANCON HE10 (Series 50, (https://www.reboul.fr/storage/00003af6.pdf Through hole pin header THT 1x39 2.00mm single row Surface mounted pin header SMD 1x37 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x28 2.54mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 2x17 2.00mm double row surface-mounted straight pin header, 1x35, 1.00mm pitch, double rows Through.

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