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42819-22XX, With thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (JEDEC MS-013AD, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_wide-rw/RW_24.pdf), generated with kicad-footprint-generator Capacitor SMD Kemet-U (6032-15 Metric), IPC_7351 nominal, (Body size source.

(400 mils 24-lead surface-mounted (SMD) DIP.
-3.216361e-04 vertex -1.034746e+02 1.027280e+02 3.455000e+01 facet normal.
X="4.85" y="1.95"/> New Pull Request

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