Labels Milestones
BackPitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x12 2.00mm double row surface-mounted straight pin header, 2x40, 2.54mm pitch, double rows Through hole angled pin header THT 2x38 2.00mm double row Through hole straight pin header, 1x37, 1.27mm pitch, double rows Surface mounted socket strip THT 1x13 2.54mm single row Surface mounted pin header THT 2x22 2.00mm double row surface-mounted straight pin header, 2x26, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled socket strip, 2x04, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x04 1.27mm single row Surface mounted socket strip SMD 1x20 2.00mm single row Through hole IDC header, 2x15, 1.00mm pitch, 2.0mm pin length, single row Surface mounted pin header SMD 1x04 1.27mm single row style2 pin1 right Through hole pin header SMD 1x31 1.00mm single.
New Pull Request