3
1
Back

Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 3.81mm post length, 1x09, 5.08mm pitch, single row Surface mounted socket strip SMD 1x10 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip SMD 1x31 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x40, 1.27mm pitch, 4.4mm socket length, double rows Through hole straight pin header, 1x07, 2.54mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x10 2.54mm single row Through hole angled pin header SMD 2x06 2.00mm double row surface-mounted straight socket strip, 1x21, 1.27mm pitch, 4.0mm pin length, double rows Through hole IDC header, 2x17, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin.

New Pull Request