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MicroClasp side entry Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-174 , 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90814-0010, 10 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator JST XA series connector, 64800611622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-108-02-xxx-DV, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100172.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py DFN 8 2x2mm, 0.5mm http://www.qorvo.com/products/d/da000896 DFN 0.5 ST 20-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 10-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 9x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 10x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 11x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), Socket 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 5, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 22-lead though-hole mounted.

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