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8-pin SuperSOT package, http://www.icbank.com/icbank_data/semi_package/ssot8_dim.pdf Power MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole straight pin header, 1x17, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled pin header, 1x06, 1.00mm pitch, double rows Through hole straight Samtec HPM power header series 11.94mm post length THT 1x10 2.54mm single row Through hole angled pin header SMD 2x12 2.00mm double row Through hole angled socket strip SMD Solder 3-pad Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, bridged with 1 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, bridged with 2 pads, pad diameter 1.4mm, outer diameter 2.1mm, see http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT.

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