3
1
Back

Package; 10-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin (https://www.ti.com/lit/ds/symlink/tps43060.pdf#page=40), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770969-x, 3 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Molex Pico-Clasp.

New Pull Request