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Ball 7x4 area grid, YBJ0008 pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 460, 2.3x2.48mm, 25.

• 1990986 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1990986), generated with kicad-footprint-generator Soldered wire.
• -2.569074e-03 9.609638e-01 facet normal.
• 9.621161e-001 2.488700e+001 facet normal -0.229615 -0.181189.

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