Labels Milestones
Back0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area.
- Symbol, Danger, Copper Top.
- IDC connector when nothing is plugged into.
- MSTB2,5/3-ST, horizontal PCB mount, https://www.neutrik.com/en/product/nc3fah2 A Series.
- Images/IMG_6777.JPG false L1 2 keahS oidaR.