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X 6.25mm package, pitch 0.4mm; see section 6.2 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 2x40, 1.00mm pitch, single row Through hole angled pin header, 1x20, 1.27mm pitch, 4.4mm socket length, single row Through hole angled pin header SMD 2x02 1.27mm double row Through hole IDC header, 2x20, 2.54mm pitch, double rows Through hole straight socket strip, 1x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole straight socket strip, 2x14, 2.54mm pitch, double rows Surface mounted pin header THT 1x02 1.00mm single row Surface mounted socket strip SMD 1x24 2.00mm single row Surface mounted pin header THT 1x01 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x20 2.54mm single row Through hole angled pin header THT 2x22 1.27mm double row Through hole straight pin header, 1x02, 2.54mm pitch, 8.51mm socket length, single row style1 pin1 left Surface mounted socket strip SMD 1x34 2.00mm single row Through hole angled pin header, 2x31, 2.54mm pitch, single row style2 pin1 right.

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