Labels Milestones
BackSOIC-8, 3.9x4.9mm² body, exposed pad, Analog Devices KS-4, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/sc70ks/ks_4.pdf Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CE.PDF DD Package; 14-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic.
- 35.6x8.3mm^2 drill 1.3mm pad 2.5mm terminal block.
- The Licensor for the hex inverter.
- Fiducial, 1.5mm bare copper, 1.5mm.
- -9.258396e-001 3.779167e-001 0.000000e+000 vertex.