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Pin (https://www.jedec.org/system/files/docs/MO-220K01.pdf (variation VJJD-5)), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-06P-1.25DS, 6 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 5, Wuerth electronics 9774010360 (https://katalog.we-online.de/em/datasheet/9774010360.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic TSSOP (4.4mm); Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Molded Narrow transistor TO-92L leads in-line (large body variant of 8-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket THT DIP DIL PDIP SMDIP 2.54mm 25.24mm 993mil 42-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 8x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils.

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