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BackFFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole socket strip THT 1x08 1.27mm single row Surface mounted pin header SMD 1x06 2.54mm single row style2 pin1 right Through hole straight pin header, 2x24, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip THT 1x15 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x07, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x38, 2.00mm pitch, double rows.
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