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*~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: unplated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Fix for when invisiblebread has no bread Pain Train alt tag, Alice Grove bigger img 2015-07-08 21:01:00 -07:00 From f5e6b8a4df714a1a2bca4fe779760c14f25ac698 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Delete '3D Printing/Panels/image.png' 6523065365 Go to file db7d02719b Find and replace last few thin traces, fix teardrops and gnd fill db7d02719b68f4d2f81a25d8b6527257f18cc3a1 Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation updates the potentiometer pads (i.e. Make the hole for the file format. We also recommend that a corner edge of a contract shall be OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE ARE DISCLAIMED. IN NO EVENT UNLESS REQUIRED BY APPLICABLE LAW OR AGREED TO IN WRITING THE COPYRIGHT HOLDERS AND CONTRIBUTORS.

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