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BackSurface package SOT 963 6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 48 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 20 leads; body width 16.90 mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile DIP Switch SPST Slide 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 18-lead though-hole mounted DIP package, row spacing 5.9 mm (232.
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