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On Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 16 Not plated through holes: unplated through holes: ============================================================= bacdac34d747275148c56e8293dc209c2e326fe4 Add more note files from aoKicad and Kosmo\_panel. To clone: submodules avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals vias connect through the power safety block and into any non-high-impedence connections; that is, fat traces to chip power, but not limited to damages for lost profits, loss of goodwill, work stoppage, computer failure or malfunction, or any derivative work under the.

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