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A Artix-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00855D.pdf#page=1 TFBGA-196, 11.0x11.0mm, 196 Ball, 14x14 Layout, 0.75mm Pitch, http://ww1.microchip.com/downloads/en/DeviceDoc/SAMA5D2-Series-Data-Sheet-DS60001476C.pdf#page=2956 FBGA-78, 10.6x7.5mm, 78 Ball, 9x13 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin thermal pad LQFP, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EA), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 0.25 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42820-32XX, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 30 Pin (JEDEC MO-153 Var DD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Hirose DF11 through hole, http://www.assmann-wsw.com/fileadmin/datasheets/ASS_0981_CO.pdf PLCC, 44 pins, single row Through hole angled socket strip, 2x39, 2.00mm pitch, 4.2mm pin length, single row Through hole angled socket strip, 1x20, 2.54mm pitch, 8.51mm socket length, double rows Through hole angled pin header THT 2x21 2.00mm double row SMD IDC box header THT 2x04 2.54mm double row surface-mounted straight pin header, 1x34, 1.27mm pitch, 4.0mm pin length, single row Through hole angled socket strip THT 2x15 2.54mm double row Through hole IDC header, 2x30, 2.00mm pitch, single row style2 pin1 right Through hole angled pin header, 2x29, 1.27mm pitch, 4.0mm pin length, double rows Through hole socket strip THT 2x33 1.27mm double row surface-mounted straight socket strip, 1x25, 2.00mm pitch, 4.2mm pin length, single row Through hole socket strip SMD 1x40 2.00mm single row Through hole straight pin header, e.g. For Wieson part number 2366C888-007 Molex 47053-1000, Foxconn HF27040-M1, Tyco 1470947-1 or equivalent, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header SMD 1x12 1.00mm single row Through hole angled pin header, 1x36, 2.54mm pitch, double rows Through hole angled pin header, 2x12, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header, 2x10, 2.54mm pitch, single row Surface mounted socket strip SMD 1x06 1.27mm single row style1 pin1.

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