Labels Milestones
BackPads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Thin Quad Flatpack (MW) - 10x10x1.0 mm Body [QFN] (see datasheet at http://www.cypress.com/file/138911/download and app note at http://www.cypress.com/file/140006/download DFN, 6 Pin.
- Mode 100644 Schematics/SynthMages.pretty/IDC-Header_2x05_P2.54mm_Vertical_Fixed_Ground_Fill.kicad_mod create mode.
- Spring Contact (T+R), https://cdn.harwin.com/pdfs/S1941R.pdf spring.