synth_tools

Back

NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 24 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 2 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator connector JAE side entry JST XH vertical JST XH series connector, B09B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator connector JST SHL series connector, B09B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 Pin (https://ams.com/documents/20143/36005/AS5055A_DS000304_2-00.pdf#page=24), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.5 mm² wires, reinforced insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1010, with PCB locator, 13 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator connector Molex SPOX Connector System, 5267-10A, 10 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA 24L 3x3.5mm Pitch 0.43mm LGA 28 5.2x3.8mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole straight pin header, 2x17, 2.54mm pitch, 6mm pin length, double rows Through hole angled pin header SMD 1x37 2.00mm single row Through hole angled pin header THT 2x06 2.00mm double row surface-mounted straight socket strip, 1x07, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x06 2.00mm double row surface-mounted straight socket strip, 2x19, 2.54mm pitch, single row Through hole angled socket strip SMD 2x13 2.00mm double row Through hole straight pin header, 2x18, 2.54mm pitch, single row Surface mounted pin header THT 1x37 2.00mm single row style2 pin1 right Through hole socket strip THT 1x16 5.08mm single row Through hole straight pin header, 1x15, 1.27mm pitch, single row Surface mounted pin header SMD 1x37 1.00mm single row Surface mounted socket strip SMD 1x03 1.27mm single row Surface mounted pin header THT 2x15 2.00mm double row Through hole straight socket strip, 2x26, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated.

New Pull Request

Labels Milestones