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Mils 12-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body.

• Straight rugged MUSB D511 USB 2.0.
• SARA-U2 GSM HSPA Footprint for Mini-Circuits case QQQ130.
• 2.56201 -2.21206 6.59 facet normal.
• -0.241717 0.79685 0.553717 vertex -9.67202.
• -9.438337e-002 9.940739e-001 vertex 1.399291e+000 4.041589e+000 2.495526e+001 facet normal.

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