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5.08mm TO-220F-2, Vertical, RM 1.27mm, staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch (http://www.st.com/resource/en/datasheet/tda7264.pdf TO-220-9 Vertical RM 5.45mm TO-3PB-3, Vertical, RM 0.9mm, staggered type-1 TO-220-15, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-7 Vertical RM 5.08mm TO-126-3, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-247-2, Horizontal, RM 2.54mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Vertical RM 1.27mm staggered type-1 TO-220F-9 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220F-4, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL ZIF 7.62mm 300mil Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas.

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