3
1
Back

Package (MD) - 4x4x0.9 mm Body [HTSSOP], with thermal vias in pads, 2 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator Molex Pico-EZmate series connector, SM12B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator JST VH top entry connector Molex Micro-Latch top entry Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-150 , 20 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors.

New Pull Request