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5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera UBGA U169 BGA-169 BGA-200, 14.5x10.0mm, 200 Ball, 12x22 Layout, 0.8x0.65mm Pitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 16x16 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x35 1.27mm double row surface-mounted straight socket strip, 2x09, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted socket strip THT 2x24 1.27mm double row Through hole Samtec HPM power header series 3.81mm post length THT 1x19 1.27mm single row Through hole straight socket strip, 2x14, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x35 1.00mm single row style2 pin1 right Through hole pin header SMD 1x02 1.27mm single row style2 pin1 right Through hole straight pin header, 2x04, 2.54mm pitch, double rows Surface mounted pin header THT 1x10 1.27mm single row Through hole angled pin header, 1x18, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x12, 2.00mm pitch, 6.35mm socket length, single row Through hole pin header SMD 1x36 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x36 2.00mm single row (from Kicad 4.0.7), script generated Through hole vertical IDC header THT 1x18 5.08mm single row Through hole straight Samtec HPM power header series 11.94mm post length, 1x01, 5.08mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x38 2.00mm single row style2 pin1 right Through hole socket strip THT 1x06 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x11 1.00mm single row Through hole pin header THT 1x36 2.00mm single row style1 pin1 left Surface mounted pin header THT 1x10 2.00mm single row Through hole Samtec HPM power header series.

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