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BackSOP, 18 Pin (JEDEC MO-153 Var DA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex LY 20 series connector, BM05B-AUHKS-GA-TB (http://www.jst-mfg.com/product/pdf/eng/eAUH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xxx-DV-BE-LC, 23 Pins per row (http://www.molex.com/pdm_docs/sd/1053091203_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-08P-1.25DSA, 8 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, 502443-0570 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.5 mm² wire, basic insulation, conductor diameter 0.9mm, length 10.0mm, width 2.4mm solder Pin_ diameter 1.3mm, wire diameter 0.8mm wire loop as test Point, diameter 1.5mm THT rectangular pad as test Point, diameter 1.0mm, hole diameter 1.4mm wire loop as test Point, diameter 3.0mm, 2 pins, diameter 5.0mm z-position of LED center 2.0mm 2 pins Rectangular size 3.9x1.9mm^2.
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