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113 ball 12x12 grid, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 1x38 1.00mm single row style2 pin1 right Through hole pin header THT 1x09 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x29 2.54mm single row style2 pin1 right Through hole angled pin header SMD 1x27 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x07 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x14 1.00mm single row style2 pin1 right Through hole angled pin header SMD 2x26 2.00mm double row Through hole angled pin header, 2x09, 1.00mm pitch, 2.0mm pin length, double rows Through hole pin header SMD 1x29 1.00mm single row Through hole straight socket strip, 1x17, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x35, 2.00mm pitch, 6.35mm socket length, single row Through hole angled socket strip, 1x01, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x20, 2.54mm pitch, double rows Through hole vertical IDC header THT 1x29 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x19 1.27mm double row Through hole straight pin.

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