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Module 16-pin module, column spacing 22.86 mm (900 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm.

HLE-149-02-xxx-DV-LC, 49 Pins per row.
= git@github.com:holmesrichards/aoKicad.git path = Kosmo_panel path .
Inductor, Bourns, SRF1260, 12.5mmx12.5mm.
DSBGA, 0.822x1.116mm, 5 bump 2x1x2.
HVQFN, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430fr5731.pdf#page=111 JEDEC MO-220.

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