Labels Milestones
BackWith vias HTSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=332), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5100, 10 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST SUR series connector, S32B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.127 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board.
- Default-closed D SPDT reed switch.
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- 13c8bcac477b612d33e1b1cfe89a6f9adc0a8935 Adding SynthMages footprint.