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8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm, handsoldering variant with enlarged pads (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Inline Wide transistor TO-92Mini package, drill 0.6mm (https://media.digikey.com/pdf/Data%20Sheets/Infineon%20PDFs/KT,KTY.pdf TO-92S package, 2-pin, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Inline Wide transistor TO-92Mini package, drill 0.6mm (https://media.digikey.com/pdf/Data%20Sheets/Infineon%20PDFs/KT,KTY.pdf TO-92S package, 2-pin, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 40 leads (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm, hand-soldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 16 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 10 leads; body width 3 mm; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads molded, narrow, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 2.54mm staggered type-1 TO-220-11, Horizontal, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Vertical RM 2.54mm TO-218-2, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 10.9mm TO-264-2, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 8.89mm 350mil SMDSocket LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT.

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