3
1
Back

FH1761 FHG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x25, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled pin header, 1x31, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted socket strip THT 1x39 1.27mm single row Through hole angled pin header, 1x35, 1.00mm pitch, double rows latches, mounting.

New Pull Request