Labels Milestones
BackF.Cu to B.Cu)" "Name": "Bottom Silk Screen" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Paste" "Name": "Top Solder Mask" "Name": "Bottom Solder Paste" "Name": "Top Silk.
- Pin, 3.81mm pitch, 15.24mm.
- Vertex -4.40436 5.23815 7.19149.
- 65x9mm^2 drill 1.3mm pad 2.5mm.
- NoLead Texas VQFN-HR, 11 Pin, https://www.ti.com/lit/ml/mpqf579/mpqf579.pdf.
- 1.8. “License” means this document.