Labels Milestones
BackHttp://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin thermal pad HTSSOP32: plastic thin shrink small outline package; 28 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100132.PDF), generated with kicad-footprint-generator JST PHD horizontal JST XA series connector, B6PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5140, 14 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator.
- -1.088952e+02 9.665134e+01 5.816697e+00 facet normal.
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Y="1.3"/>
Diameter 2.3mm, size source Multi-Contact FLEXI-E.