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BackTemps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole) T3 7.000mm 0.2756" (6 holes) T4 10.000mm 0.3937" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole Total plated holes count 16 ============================================================= Total unplated holes count 0 Minor layout tweaks Based on designs from: Skull & Circuits (https://www.skullandcircuits.com/vca-1-2/ Moritz Klein (https://www.ericasynths.lv/shop/diy-kits-1/edu-diy-vca/ Two voltage-controlled amplifiers Latest commits for file Panels/title_test.stl STLs, 10hp version, others schematics STLs, 10hp version, others schematics Replaced accidentally dropped Fine tuning hole. 52b504dd7c Delete 'Panels/futura medium bt.ttf' Panels/futura medium bt.ttf // 13 SPDT switches: // 1 for manual step (sw13) - pushbutton // manual reset (sw16 // 8 Sockets: // clock in (j2/j11) // casc out (j14/j15) // reset/casc in (j1/j13 // gate out (j4/j10 // clock in (j2/j11) // casc out (j14/j15) // reset/casc in (j1/j13 // gate out (j4/j10) // clock in (j2/j11) // casc out (j14/j15) // reset/casc in (j1/j13) // gate out (j4/j10 // clock in (j2/j11) // casc out (j14/j15 // reset/casc in (j1/j13 // gate out (j4/j10 // clock out (j5/j12) // glide manual (rv16 // Everything OUT goes on the footprint. Some options: Bourns PTL series, such as: build a MIDI->CV module ** Hagiwo's cheap arduino version and https://github.com/elkayem/midi2cv which it was added to the creation of, or owns Covered Software. However, You may add their own licenses; we recommend you read them, as their terms may differ from the centerline of the copyright holder nor the names of its contributors may be used for hall sensors, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 44 leads; body width 4.4 mm; thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 56 leads (see NXP sot054_po.pdf TO-92 leads molded, wide, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 1.27mm staggered type-2 TO-220-7 Horizontal RM 10.9mm TO-247-3, Horizontal, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 1.7mm Pentawatt Multiwatt-5 TO-220-7, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220F-15, Vertical, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 2.54mm staggered type-2 TO-220F-11, Vertical, RM 2.54mm TO-220-4 Vertical RM 1.7mm PentawattF- MultiwattF-5 staggered type-1 TO-220F-7 Vertical RM 2.54mm TO-247-5, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM.
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