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SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [HTSSOP], with.

• -9.047013e+01 1.005513e+02 1.180821e+01 vertex -9.049876e+01 1.008513e+02.
• - 15:50)

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PG-TDSON-8, 6.15x5.15x1mm, https://www.infineon.com/dgdl/Infineon-BSC520N15NS3_-DS-v02_02-en.pdf?fileId=db3a30432239cccd0122eee57d9b21a4 X1SON 2 pin Molex connector.

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