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MLF - 3x3x0.85 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 10 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf TSSOP, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=16), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B20B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (https://www.infineon.com/dgdl/Infineon-MA12040-DS-v01_00-EN.pdf?fileId=5546d46264a8de7e0164b7467a3d617c#page=81), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1104, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated.

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