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BackWork, but excluding communication that is PCB and IDC, so expanding to a separate module? If possible? Full unit is ~$8.50 - $10 in parts, needing only one side to a Work for part through the power subsystem Checkpoint after converting most things to SMD Binary files /dev/null and b/Panels/futura medium bt.ttf | Bin 0 -> 2506984 bytes Panels/title_test.scad | 22 Panels/title_test.stl | Bin 0 -> 11692 bytes 3D Printing/Panels/MAGIC MISSILE VCF.png' f1ff8406b4 Delete '3D Printing/Panels/HOLD PORTAL.png' 3D Printing/Panels/HOLD PORTAL.png and /dev/null differ Latest commits for file Panels/10_step_seq.scad Experimenting with more representative footprint. Improve capacitor footprints, especially the pitch of the holder // e.g.: Radio Shaek is 51mm x 70mm and 1.2mm thick module pcb_holder(h, l, th, wall_thickness=thickness) { v_wall(h, l, wall_thickness); Align panel to integer pseudo-origin, remove testing.
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