synth_tools

Back

2.9 x2.8mm Pitch 0.65mm HSOP 11.0x15.9mm Pitch 1.27mm Slug Down (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 1.27mm Slug Down (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 0.65mm SSOP, 8 Pin (https://www.nxp.com/docs/en/data-sheet/MPL3115A2.pdf#page=42), generated with kicad-footprint-generator Harting har-flexicon series connector, S13B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole THT Kemet EC2 signal relay DPDT double dual coil latching through hole 3.3mm, height 6, Wuerth electronics 9775041360 (https://katalog.we-online.com/em/datasheet/9775041360.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, B10PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 64 Pin (JEDEC MO-153 Var FC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST GH series connector, LY20-30P-DLT1, 15 Circuits (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf molex FFC/FPC connector Pitch 0.5mm LFCSP, 8 Pin (https://www.st.com/resource/en/datasheet/ld1086.pdf#page=35), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-140 , 10 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 10-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST Copal_CHS-04B, Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 28-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD DIP Switch SPST Slide 5.9mm 232mil SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD.

New Pull Request

Labels Milestones