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205-00068 pitch 7.5mm Varistor, diameter 9mm, width 4.5mm, pitch 5mm size 20x9.8mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type067_RT01905HDWC, 5 pins, single row Through hole angled socket strip THT 2x35 2.54mm double row surface-mounted straight socket strip, 2x13, 2.00mm pitch, 4.2mm pin length, single row Surface mounted socket strip SMD 1x27 2.54mm single row style1 pin1 left Surface mounted pin header THT 1x25 2.00mm single row style2 pin1 right Through hole angled pin header, 2x18, 2.54mm pitch, double rows Through hole straight socket strip, 2x20, 2.00mm pitch, double rows Surface mounted pin header THT 2x20 1.27mm double row surface-mounted straight socket strip, 1x22, 2.54mm pitch, single row Surface mounted pin header THT 1x31 1.27mm single row Through hole angled socket strip SMD 1x33 2.54mm single row Surface mounted socket strip THT 1x36 2.00mm single row Through hole straight pin header, 1x34, 1.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip SMD 2x13 2.54mm double row surface-mounted straight pin header, 2x37, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header THT 2x13 1.00mm double row Through hole angled pin header SMD 2x03 2.54mm double row surface-mounted straight socket strip, 2x18, 2.54mm pitch, 6mm pin length, double rows Through hole straight socket strip, 2x31, 1.27mm pitch, single row style2 pin1 right Through hole pin header THT 2x22 2.54mm double row Through hole straight pin header, 2x29, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf WLCSP-25, 5x5 raster, 2.133x2.070mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster.

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