synth_tools

Back

Pitch 14.30mm Resistor, Axial_Shunt series, Box, pin pitch=30.48mm, 4W, length*width*height=20*6.4*6.4mm^3, http://cdn-reichelt.de/documents/datenblatt/B400/5WAXIAL_9WAXIAL_11WAXIAL_17WAXIAL%23YAG.pdf Resistor Axial_Power series Box pin pitch 5.00mm diameter 10mm Electrolytic Capacitor CP, Radial_Tantal series, Radial, pin pitch=10.00mm, diameter=24mm, height=40mm, Electrolytic Capacitor, , http://www.vishay.com/docs/42037/53d.pdf CP Axial series Axial Horizontal pin pitch 5.00mm diameter 9.0mm Tantal Electrolytic Capacitor, , http://www.vishay.com/docs/42037/53d.pdf CP Axial series Axial Vertical pin pitch 5.00mm diameter 10.0mm 2 pins diameter 3.0mm z-position of LED center 1.0mm, 2 pins LED, diameter 10.0mm, 2 pins, http://cdn-reichelt.de/documents/datenblatt/A500/LED8MMGE_LED8MMGN_LED8MMRT%23KIN.pdf LED diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.0mm, 2 pins LED, Round, FlatTop, Rectangular size 3.9x1.8mm^2 2 pins Rectangular size 5.0x2.0mm^2 z-position of LED center 6.0mm, 2 pins, pitch 5mm, size 45x9mm^2, drill diamater 1.15mm, pad diameter 2.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 54722-0404, 40 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 28 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2055-5)), generated with kicad-footprint-generator Fuse SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: https://www.vishay.com/docs/48064/_t58_vmn_pt0471_1601.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-138-02-xxx-DV-LC, 38 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST ZE series connector, B12B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.5mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for the flat make the hole diamater fits well on the lower 5 mm | | | R3, R21, R27, R28 | 3 | 10 uF | Unpolarized capacitor | | S1 | 1 | AudioJack2_SwitchT | Audio Jack, 2 Poles (Mono / TS), Switched T Pole (Normalling) | | | | | | | S3 | 1 | SW_Push | Push.

New Pull Request

Labels Milestones