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11x11 raster, 10x10mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.8mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole pin header THT 1x01 2.54mm single row Through hole angled socket strip SMD 2x13 2.00mm double row Through hole straight Samtec HPM power header series 11.94mm post length, 1x03, 5.08mm pitch, single row style2 pin1 right Through hole angled pin header SMD 2x27 1.00mm double row Through hole angled socket strip, 2x27, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x33 2.00mm single row Through hole angled pin header, 2x17, 2.54mm pitch, 8.51mm socket length, double rows Through hole pin header THT 1x02 2.00mm single row Through hole straight pin header, 2x37.

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