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40.52 Pitch 5mm relay dpdt fujitsu tht Kemet signal relay, DPDT, non-latching, single coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf Kemet EC2 signal relay DPDT double dual coil latching through hole M3, height 1, Wuerth electronics 9774100482 (https://katalog.we-online.de/em/datasheet/9774100482.pdf), generated with kicad-footprint-generator JST GH series connector, 502386-1370 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-08P-1.25DS, 8 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0120, 12 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-4410, 44 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py FE Package; 16-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 1.27 16 12 Wide 16-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T2855-3)), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=295), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 4.5, Wuerth electronics 9774080982 (https://katalog.we-online.de/em/datasheet/9774080982.pdf), generated with kicad-footprint-generator JST.

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