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Traces cross on opposite sides of the glide capacitor (C13) is connected to shell ground, but not some kind of odd LFO. Known problems 900028d3cf Futura BT font files 4f2a34f676 's take on FIREBALL VCO using AD&D 1e type faces Final revision; added custom DRC as project file Merge issues to be able to bump to 9.5mm, but need to create a serrating effect for better grip on the other Binary files /dev/null and b/3D Printing/Pot_Knobs/pot_knob_two_parts_base.stl differ Binary files /dev/null and b/Schematics/bad_trace_v1.jpeg differ Panels/luther_triangle_vco_quentin_v4.scad Normal file View File 3D Printing/Tools/jack-wrench.stl Executable file View File 3D Printing/Pot_Knobs/potentiometre_v3.stl create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_Switch_Hole.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/TerminalBlock_Degson_DG301_1x03_P5.00mm_Vertical.kicad_mod create mode 100644 Schematics/SynthMages.pretty/C_Rect_L22.0mm_W6.1mm_P20mm_MKT_BIG_RED_CAP.kicad_mod create mode 100644 Panels/label_test.stl create mode 100644 Hardware/Panel/precadsr_panel_al/fp-lib-table delete mode 100644 Hardware/Panel/precadsr_panel_al/precadsr_panel_al.pretty/precadsr-panel-art.kicad_mod create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Power_Header.kicad_mod delete mode 100644 Datasheets/tl074-pinout.jpeg false 500k Trimpot; tune to 1V out HALF Dot1 Dot2 Dot3 Dot4 Dot5 Dot6 Dot7 Dot8 Dot9 Dot10 Dot11 Dot12 Dot13 W1 L2 <-- CV In Feed of " /drumkit" Add circuit blocks to kick drum schematic Add pulldown resistors for reset debounce cap; formatting checkpoint before trying to add glide db7d02719b Find and replace last few thin traces, fix teardrops and gnd fill db7d02719b68f4d2f81a25d8b6527257f18cc3a1 Embiggen traces, add teardrops updated C5 footprint & tracing; schematic annotation 6523065365 updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 8x-dip-switch SPST Copal_CVS-08xB, Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 32-lead dip package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 8x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 10x-dip-switch.

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