Labels Milestones

Back

Vertical Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 12-lead though-hole mounted.

• 3.96091 -0.604356 18.8084 facet normal -3.677414e-02 -4.257209e-03.
• 0.392551 -0.734383 0.553702 facet normal.
• 6.870092e-01 0.000000e+00 vertex -1.036795e+02 9.542199e+01 1.855000e+01 vertex.
• Changjiang, FNR8050S, 8.0x8.0x5.0mm, https://datasheet.lcsc.com/lcsc/1806131217_cjiang-Changjiang-Microelectronics-Tech-FNR5040S3R3NT_C167960.pdf Inductor, Chilisin.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects