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BGA-36 V36 VBGA BGA-48 - pitch 0.8 mm Highspeed card edge card connector socket for 2.36mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge card connector socket for 1.57mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for 2.4mm PCB's with 70 contacts (polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for 1.6mm PCB's with 50 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 20 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 08 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 70 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 20 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 30 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 30 contacts (polarized Highspeed card edge connector for PCB's with 50 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 05 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 20 contacts (polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins, weld tabs, board locks (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-112-02-xx-DV-TE, 12 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 10.

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