Labels Milestones
BackBall grid, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.65mm UFBGA-32, 6x6, 4x4mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch.
- -2.9093 18.8747 vertex -1.2151 -2.93351 18.7502 vertex.
- Vertex 1.52047 -3.02412 6.59 facet normal -2.129180e-001 3.650216e-001.
- 1.82407 11.0482 facet normal -0.331544 0.422843 0.843375.
- Lead Plastic Package OnSemi.
- Macro Package Style M234 Rohm.