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16.90 mm Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf.

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